Job Description

Responsibilities may be quite diverse of a technical nature.

• Intel advanced packaging technology pathfinding project management

• Integration of packaging processes/designs/simulation/test/reliability/ Failure Analysis (FA) according to Intel biz process

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• With a valid in-school student status

• Currently in 3rd/4th year of college or 2nd year of graduate students are recommended

Preferred Qualifications:

• The candidate must be an active student currently pursuing degrees/master/PHD in Material science , physics, chemical/electronic/electrical/mechanical engineering

• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.