Description

Seed Engineer program is an eight-week summer camp internship experience that combines immersive Amazon peculiar culture, technical courses, hackathon, professional skills training together with practical project experience. The Seed Engineer is to build future Software Development Engineer (SDE) and Hardware Development Engineer (HDE) talents in Asia.

At Amazon, we hire the best minds in technology to innovate and build on behalf of our customers. The intense focus we have on our customers is why we are one of the world’s most beloved brands – customer obsession is part of our company DNA. Our interns write real software and collaborate with a select group of experienced software development engineers (SDEs) who guide interns on projects that matter to our customers.

As a Hardware Development Engineer intern you will engage with an experienced cross-disciplinary staff to conceive and design innovative consumer products. You will work closely with an internal inter-disciplinary team, and outside partners to drive key aspects of product definition, execution, and test. As part of a project team you will support the design, debug, validation and optimization of the products. You will be involved in projects from concept through production, gaining exposure to the complete design lifecycle. You will also support engineering builds gaining experience with high volume manufacturing.

In addition to working on an impactful project, you will have the opportunity to engage with Amazonians for both personal and professional development, expand your network, and participate in activities with other interns throughout your internship. No matter the location of your internship, we give you the tools to own your project and learn in a real-world setting.

To qualify, applicants should be upcoming 3rd year college students (in a 4-year study) and upcoming 2nd year master students (in a 3-year study) with target graduation date in 2026.

Time: 8-week summer camp from Jun 24th, 2024 to August 16th, 2024

Key job responsibilities

• Learn and become familiar with Amazon hardware development process

• Work closely with Hardware Engineering teams as well as suppliers to support development lifecycle

• Work on a specific project assigned by the business team

• Attend technical trainings and participate in mini-hackathon program

• Other daily tasks assigned by the hiring manager/technical mentor

We are open to hiring candidates to work out of one of the following locations:

Shenzhen, 44, CHN

Basic Qualifications

• Upcoming 3rd year college students (in a 4-year study) and upcoming 2nd year master students (in a 3-year study) with target graduation date in 2026.

• Major in Electrical Engineering, Mechanical Engineering, Computer Science, Electronics, Communication Engineering, Material Science, Photonics or Systems Engineering or related field at time of application.

• Working proficiency in English

Preferred Qualifications

• Previous internship(s) or project experience, if applicable.

• Knowledge of electronic components, design validation, qualification, and analysis

• Learn fast and have a good problem-solving methodology.

• Ability to effectively articulate technical challenges and solutions.

• Adept at handling ambiguous or undefined problems as well as ability to think abstractly.

• Great written and oral communication skills